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smt貼片檢驗標準

Release Time:2020-11-09 Edit the author:金致卓 Reading:310

   本文關于SMT貼片加gong工藝檢驗標準,以下是詳細內容:


  一、SMT貼片錫膏工藝

  1.PCB板上印刷的噴錫的位置與焊盤居中,無ming顯的偏移,不可影響SMT元件粘貼與上錫效guo。


  2.PCB板上印刷噴錫量適中,不能完整的覆蓋焊盤,少錫、漏刷。


  3.PCB板上印刷噴錫點成形不良,印刷噴錫連錫、噴錫成凹凸不平狀,噴錫移位超焊盤三分之一。


  二、SMT貼片紅膠工藝

  1.印刷紅膠的位置居中,無ming顯的偏移,不可以影響粘貼與焊錫。


  2.印刷紅膠膠量適中,能良好的粘貼,無欠膠。


  3.印刷紅膠膠點偏移兩焊盤中間,可能造成元件與焊盤不易上錫。


  4.印刷紅膠量過多,從元件體側下面滲出的膠的寬度大于元件體寬的二分之一。


  三、SMT貼片工藝

  1、SMT元器件貼裝需整齊、正中,無偏移、歪斜。


  2、SMT元器件貼裝位置的元器件型號規格應正確,元器件應反面。元器件貼反(不允許元件有區別的相對稱的兩個面互換位置,如:有絲印標識的面與無絲印標識的面上下顛倒面),功能無法實現。


  3、有極性要求的貼片元器件貼裝需按正確的極性標示加工。器件極性貼反、錯誤(二極管、三極管、鉭質電容)。


  4、多引腳器件或相鄰元件焊盤應無連錫、橋接短路。


  5.多引腳器件或相鄰元件焊盤上應無殘留的錫珠、錫渣。

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